Samsung had an industry Foundry event focused on solutions for “Empowering the AI Revolution,” where they announced new process nodes and technology developments. The company announced technology roadmaps going out to 2027 .In particular, Samsung announced two new process nodes, SF2Z and SF4U. The 2nm SF2Z, includes a backside power delivery network to eliminate interference of power with signal lines.
Samsung AI foundry solutions include gate all around CMOS processes providing low power AI chips but as shown to the right, the company will be introducing co-packaged optics in chiplet architectures by 2027 to provide even higher performance.Samsung says that its Samsung foundry AI sales have increased by 80% over the past year. In addition to leading edge process nodes the company is offering specialty and 8-inch wafer products as well.
In addition to its foundry business, Samsung is the market leader in DRAM and NAND flash, introducing some of the industry’s first CXL memory in 2022 and introducing the first LPCAMM2 DRAM and the first GDDR7 DRAM earlier in 2023. DRAM, especially in high bandwidth memory modules are an important component in AI processing packages . Samsung was showing HBM packages in its announcements.